Start Date: 07/04/2024
Price 8,232 ILS
/ 24 Tcs
DURATION 4 Days
Course Overview
Learn when and how to apply signal integrity techniques to high-speed interfaces between Xilinx FPGAs and other components. This comprehensive course combines design techniques and methodology with relevant background concepts of high-speed bus and clock design, including transmission line termination, loading, and jitter. You will work with IBIS & IBIS AMI models and complete simulations using Mentor Graphics HyperLynx. Other topics include managing PCB effects and on-chip termination. This course balances lecture modules with instructor demonstrations and practical hands-on labs.
Level:
Connectivity 3Who should attend?
Digital designers, board layout designers, or scientists, engineers, and technologists seeking to implement Xilinx solutions. Also end users of Xilinx products who want to understand how to implement high-speed interfaces without incurring the signal integrity problems related to timing, crosstalk, and overshoot or undershoot infractionPrerequisite:
- FPGA design experience preferred (Designing FPGAs Using the Vivado Design Suite 1 course or equivalent)
- Familiarity with high-speed PCB concepts
- Basic knowledge of digital and analog circuit design
- Basic experience in handling of new software tool
- Vivado™ tool knowledge is helpful
- Hyperlynx tool knowledge is helpful
Software Tools:
- Mentor Graphics HyperLynx 8.2.1
Hardware:
- Architecture: N/A*
- Demo board: None*
* This course does not focus on any particular architectute
Skills Gained: After completing this training, you will be able to:
- Describe signal integrity effects
- Predict and overcome signal integrity challenges
- Simulate signal integrity effects
- Verify and derive High-Speed design rules for the board design
- Apply signal integrity techniques to high-speed interfaces between Xilinx FPGAs and semiconductor circuits
- Understand S-parameters and simulate with IBIS-AMI
- Plan your board design under FPGA-specific restrictions
- Supply the FPGAs with power
- Handle thermal aspects
- Handle thermal aspects
- Simulate signal integrity effects using IBIS- & IBIS-AMI models at High Multi-Gigabit rates
- Understand Serial transceivers usage with both TX & RX equalization signal impairments including Hands-on tips
- Design Multi-Gigabit high speed links through high frequency design flow: S-parameters, Pre-Layout and Post-Layout Simulations
- Understand High speed links from Analog/RF point of view
- Debug High-Speed Multi-Gigabit links via High frequency techniques such as multi-mode S-parameters
Lab Description:
- Lab 1: Invoking HyperLynx – Become familiar with signal integrity tools. Use HyperLynx for schematic entry, modeling, and simulation. Modify a standard IBIS model to define a driver and then use its stackup editor to define a PCB.
- Lab 2: Reflection Analysis – Define a circuit and run various simulations for effects of reflection.
- Lab 3: Crosstalk Analysis – Using simulation, analyze circuit topology and PCB data for strategies to minimizecrosstalk.
- Lab 4: DDR3/4 – Simulate DDR design including eye diagram.
- Lab 5: Case study – whiteboard exercised on SI effects.
- Lab 6: Pre-layout simulation with IBIS-AMI models.
- Lab 7 Post-layout simulation with IBIS-AMI models.
Course Outline:
- Signal Integrity Introduction
- Transmission Lines
- IBIS Models and SI Tools
- Lab 1: Invoking HyperLynx
- Reflections
- Lab 2: Reflection Analysis
- Crosstalk
- Lab 3: Crosstalk Analysis
- FPGA Power Supply
- Power Supply Issues
- Signal Interfacing: Interfacing in General
- Lab 4: DDR3/4 Example
- PCB Details & Die Architecture and Packaging
- Thermal Aspects
- FPGA Configuration and PCB
- Signal Interfacing: FPGA-Specific Interfacing
- Lab 5: Case study
- High-Speed SerDes Transceivers Overview
- Introduction to S-parameters for High-Speed applications
- Introduction to IBIS-AMI models & High-Speed hands-on design tips
- Lab 6: Pre-layout simulation with IBIS-AMI models (~25Gbps)
- Lab 7: Post-layout simulation with IBIS-AMI models (~25Gbps)
- Course Summary